Professor of Electrical Engineering and Computer Science

Contact

2145 Sheridan Road
Tech Room L471
Evanston, IL 60208-3109

847-491-7378Email Seda Memik

Website

Seda Ogrenci Memik's Homepage

Center for Ultra-scale Computing and Information Security

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Departments

Electrical Engineering and Computer Science

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Education

Ph.D. Computer Science, University of California, Los Angeles, CA

M.S. Electrical and Computer Engineering, Northwestern University, Evanston, IL

B.S. Electrical and Electronic Engineering, Bogazici University, Istanbul, Turkey

Research Interests

Design Automation, thermal aware design of circuits and systems, thermal sensing and cooling systems for high performance systems, power and energy aware memory systems.

Selected Publications

• Alberto A. Del Barrio, Roman Hermida, Seda Ogrenci Memik, “A Combined Arithmetic-High-Level Synthesis Solution to Deploy Partial Carry-Save Radix-8 Booth Multipliers in Datapaths”, IEEE Transactions on Circuits and Systems I: Regular Papers, (2018)
• Kaicheng Zhang, Akhil Guliani, Seda Ogrenci Memik, Gokhan Memik, Kazutomo Yoshii, Rajesh Sankaran, Pete Beckman, “Machine Learning-Based Temperature Prediction for Runtime Thermal Management Across System Components”, IEEE Transactions on Parallel and Distributed Systems, (2018)
• Yingyi Luo, Xianshan Wen, Kazutomo Yoshii, Seda Ogrenci Memik, Gokhan Memik, Hal Finkel, Franck Cappello, “Evaluating irregular memory access on OpenCL FPGA platforms”, 2017 27th International Conference on Field Programmable Logic and Applications, FPL 2017, (2017)
• Siddhartha Joshi, Dawei Li, Seda Ogrenci-Memik, Grzegorz Deptuch, James Hoff, Sergo Jindariani, Tiehui Liu, Jamieson Olsen, Nhan Tran, “A content addressable memory with multi-Vdd scheme for low power tunable operation”, 2017 IEEE 60th International Midwest Symposium on Circuits and Systems, MWSCAS 2017, (2017)
• Yingyi Luo, Seda Ogrenci-Memik, Jie Gu, “Cell-to-array thermal-aware analysis of stacked RRAM”, IEEE International Symposium on Circuits and Systems, (2017)
• Dawei Li, Siddhartha Joshi, Ji Hoon Kim, Seda Ogrenci Memik, “End-to-End Analysis of Integration for Thermocouple-Based Sensors into 3-D ICs”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, (2017)
• Dawei Li, Siddhartha Joshi, Ji Hoon Kim, Seda Ogrenci-Memik, “End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, (2017)
• Dawei Li, Kaicheng Zhang, Akhil Guliani, Seda Ogrenci-Memik, “Adaptive Thermal Management for 3D ICs with Stacked DRAM Caches”, Proceedings of the 54th Annual Design Automation Conference 2017, DAC 2017, (2017)