Faculty Directory
Yonggang Huang

Walter P. Murphy Professor of Civil and Environmental Engineering and Mechanical Engineering (by courtesy) Materials Science and Engineering

Publications

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Contact

2145 Sheridan Road
TECH A116
Evanston, IL 60208-3109

847-467-3165Email Yonggang Huang

Departments

Civil and Environmental Engineering

Mechanical Engineering

Materials Science and Engineering

Affiliations

Theoretical and Applied Mechanics Graduate Program

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Education

Ph.D. Engineering Science Harvard University, Cambridge, MA

M.S. Engineering Science Harvard University, Cambridge, MA

B.S. Mechanics Peking University, Beijing, China


Research Interests

Yonggang Huang is the Walter P. Murphy Professor of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering at Northwestern University.  He is interested in mechanics of stretchable and flexible electronics, and deterministic 3D assembly.  He has published 2 books and more than 500 journal papers, including 10 in Science and 4 in Nature.  He is a member of US National Academy of Engineering, a member of European Academy of Sciences and Arts, a foreign member of Academia Europaea, and a foreign member of Chinese Academy of Sciences.  His recent research awards include the Larson Award in 2003, Melville Medal in 2004, Richards Award in 2010, Drucker Medal in 2013, Nadai Medal in 2016 and Thurston Lecture Award in 2019 from the American Society of Mechanical Engineers (ASME); Young Investigator Medal in 2006 and Prager Medal in 2017 from the Society of Engineering Sciences; International Journal of Plasticity Medal in 2007; Guggenheim Fellowship from the John Simon Guggenheim Foundation in 2008; and Bazant Medal in 2018 and von Karman Medal in 2019 from American Society of Civil Engineers.  He is a Highly Cited Researcher in Engineering (2009) and, in Materials Science (2014-), and in Physics (2018-).  His recognitions for undergraduate teaching and advising include the Most Supportive Junior Faculty Member from the Department of Aerospace and Mechanical Engineering, University of Arizona in 1993; Engineering Council Award for Excellence in Advising from the College of Engineering, University of Illinois at Urbana-Champaign in 2007; Cole-Higgins Award for Excellence in Teaching, McCormick School of Engineering, Northwestern University in 2016; and Associated Student Government Faculty and Administrator Honor Roll, Northwestern University, 2018-2019.  He is the Editor of Journal of Applied Mechanics (Transactions of ASME), a member of the Executive Committee of the ASME Applied Mechanics Division (Chair, 2019-2020).


Significant Recognition

  • Member, National Academy of Engineering
  • Foreign Member, Academia Europaea
  • Foreign Member, Chinese Academy of Sciences
  • Member, European Academy of Arts and Sciences
  • von Karman Medal, American Society of Civil Engineers, 2019
  • Bazant Medal, American Society of Civil Engineers, 2018
  • Prager Medal, Society of Engineering Sciences, 2017
  • Nadai Medal, American Society of Mechanical Engineers, 2016
  • Drucker Medal, American Society of Mechanical Engineers, 2013
  • Richards Award, American Society of Mechanical Engineers and Pi Tau Sigma (National Mechanical Engineering Honor Society), 2010
  • Guggenheim Fellowship, John Simon Guggenheim Memorial Foundation, 2008

Significant Professional Service

  • Technical Editor, Journal of Applied Mechanics (ASME Transactions), 2012-
  • Editor in Chief, Theoretical and Applied Mechanics Letters, 2011-

Selected Publications

    1. Khang et al., “A stretchable form of single crystal silicon for high performance electronics on rubber substrates,” Science, v 311, pp 208-212, 2006.
    2. Kim et al., "Stretchable and foldable silicon integrated circuits," Science, v 320, pp 507-511, 2008 (Inner cover feature article).
    3. Ko et al., "A hemispherical electronic eye camera based on compressible silicon optoelectronics," Nature, v 454, pp 748-753, 2008 (cover feature article).
    4. Park et al., "Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays," Science, v 325, pp 977-981, 2009.
    5. Rogers JA, Someya T, and Huang Y, "Materials and mechanics for stretchable electronics," Science, v 327, pp 1603-1607, 2010 (review article).
    6. Kim et al., "Epidermal electronics," Science, v 333, pp 838-843, 2011.
    7. Hwang et al., “A physically transient form of silicon electronics,” Science, v 337, pp 1640-1644, 2012 (cover feature article).
    8. Kim et al., “Injectable, cellular-scale optoelectronics with applications for wireless optogenetics,” Science, v 340, pp 211-216, 2013.
    9. Song et al., “Digital cameras with designs inspired by the arthropod eye,” Nature, v 497, pp 95-99, 2013 (cover feature article).
    10. Xu et al., “Soft microfluidic assemblies of sensors, circuits and radios for the skin,” Science, v 344, pp 70-74, 2014.
    11. Xu et al., “Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling,” Science, v 347, pp 154-159, 2015. (cover feature article)
    12. Kang et al., “Bioresorbable silicon sensors for the brain,” Nature, v 530, pp 71-76, 2016.

    13. Chung et al., “Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care,” Science, v 363, article eaau0780, 2019.

    14. Mickle et al., "A wireless closed-loop system for optogenetic peripheral neuromodulation," Nature, v 565, pp 361-365, 2019.