Faculty Directory
Carolyn Duran

Adjunct Professor of Materials Science and Engineering

Vice President, Memory and IO Technologies, Intel Corporation

2021 Materials Research Society Vice President

Contact

2220 Campus Drive
Cook Hall, Room 2036
Evanston, IL 60208-3109

Email Carolyn Duran

Website


Departments

Materials Science and Engineering


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Education

Ph.D., Materials Science and Engineering, Northwestern University

B.S., Materials Science and Engineering, Carnegie Mellon University


Biography

Dr. Carolyn R. Duran is a vice president in the Data Platforms Group and engineering manager of Memory and I/O Technologies. She is responsible for a corporate charter including pathfinding, architecture, validation, and standards development. She leads the teams driving these critical technologies from early definition, through development, to broad industry enablement.


Significant Recognition

  • Fast Company's "Most Creative People in Business 1000" (2016)
  • Ranked #2 in Business Insider's "Most Powerful Women Engineers in the World" (2014)
  • Intel Achievement Award (2014)
  • National Science Foundation Fellowship (1994)

Significant Professional Service

  • Materials Research Society, 2022 President-elect
  • Board of Directors, Responsible Business Alliance (2016-2017, Chair in 2017)
  • Steering Committee Chair, Responsible Minerals Initiative (2015-2016)
  • Northwestern University Materials Science and Engineering Academic Advisory Board (2008-present)
  • University of California Berkeley Materials Science and Engineering Advisory Board (2003-present)

Patents

  1. Diana, D.C., Duran, C.R., Lindstedt, R.C., Silberstein, M.E. 2008 Ferroelectric polymer memory structure and method therefor, US Patent Number 7344897
  2. Miaz, J.A., Morrow, X., Marieb, T., Block, C. (née Duran), Leu, J., McGregor, P., Kuhn, M., Taylor, M. 2004 Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement, US Patent Number 6794755
  3. Marieb, T.N., McGregor, P., Block, C. (née Duran), Jin, S. 2007 Copper alloys for interconnections having improved electromigration characteristics and methods of making same, US Patent Number 7220674
  4. Marieb, T.N., McGregor, P., Block, C. (née Duran), Jin, S. 2005 Copper alloys for interconnections having improved electromigration characteristics and methods of making same, US Patent Number 6977220
  5. Marieb, T.N., McGregor, P., Block, C. (née Duran), Jin, S. 2004 Copper alloys for interconnections having improved electromigration characteristics and methods of making same, US Patent Number 6800554