Faculty Directory
Yonggang Huang

Jan and Marcia Achenbach Professorship in Mechanical Engineering, Civil and Environmental Engineering, and (by courtesy) Materials Science and Engineering

Publications

Download a complete list of publications

Contact

2145 Sheridan Road
TECH A116
Evanston, IL 60208-3109

847-467-3165Email Yonggang Huang

Departments

Civil and Environmental Engineering

Mechanical Engineering

Materials Science and Engineering

Affiliations

Theoretical and Applied Mechanics Graduate Program

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Education

Ph.D. Engineering Science Harvard University, Cambridge, MA

M.S. Engineering Science Harvard University, Cambridge, MA

B.S. Mechanics Peking University, Beijing, China


Research Interests

Yonggang Huang is the Achenbach Professor of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering at Northwestern University. He is interested in mechanics of stretchable and flexible electronics, and deterministic 3D assembly. He has published 2 books and more than 700 journal papers, including 16 in Science and 10 in Nature. He is a Highly Cited Researcher in Engineering (2009), in Materials Science (since 2014), and in Physics (2018).  He is a member of US National Academy of Engineering, US National Academy of Sciences, American Academy of Arts and Sciences, and a foreign of Royal Society (London). His recognitions for undergraduate teaching include the Cole-Higgins Award for Excellence in Teaching, McCormick School of Engineering, Northwestern University in 2016 and 2024.


Significant Recognition

  • Member, National Academy of Sciences
  • Fellow, American Academy of Arts and Sciences
  • Member, National Academy of Engineering
  • Foreign Member, Academia Europaea
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, European Academy of Sciences and Arts
  • Honorary Member, American Society of Mechanical Engineers, 2021
  • Thurston Lecture Award, American Society of Mechanical Engineers, 2019
  • von Karman Medal, American Society of Civil Engineers, 2019
  • Bazant Medal, American Society of Civil Engineers, 2018
  • Prager Medal, Society of Engineering Sciences, 2017
  • Nadai Medal, American Society of Mechanical Engineers, 2016
  • Drucker Medal, American Society of Mechanical Engineers, 2013
  • Richards Award, American Society of Mechanical Engineers and Pi Tau Sigma (National Mechanical Engineering Honor Society), 2010
  • Guggenheim Fellowship, John Simon Guggenheim Memorial Foundation, 2008

Significant Professional Service

  • Editor in Chief, Journal of Applied Mechanics (ASME Transactions), 2012-
  • Co-Editor in Chief, Theoretical and Applied Mechanics Letters, 2011-
  • President, Society of Engineering Sciences, 2014
  • Chair, ASME Applied Mechanics Division, 2019-2020

Selected Publications

  1. Khang et al., “A stretchable form of single crystal silicon for high performance electronics on rubber substrates,” Science, v 311, pp 208-212, 2006.
  2. Kim et al., "Stretchable and foldable silicon integrated circuits," Science, v 320, pp 507-511, 2008 (Inner cover feature article).
  3. Ko et al., "A hemispherical electronic eye camera based on compressible silicon optoelectronics," Nature, v 454, pp 748-753, 2008.
  4. Rogers JA, Someya T, and Huang Y, "Materials and mechanics for stretchable electronics," Science, v 327, pp 1603-1607, 2010.
  5. Kim et al., "Epidermal electronics," Science, v 333, pp 838-843, 2011.
  6. Song et al., “Digital cameras with designs inspired by the arthropod eye,” Nature, v 497, pp 95-99, 2013 (cover feature article).
  7. Xu et al., “Soft microfluidic assemblies of sensors, circuits and radios for the skin,” Science, v 344, pp 70-74, 2014.
  8. Xu et al., “Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling,” Science, v 347, pp 154-159, 2015.
  9. Kang et al., “Bioresorbable silicon electronic sensors for the brain,” Nature, v 530, pp 71-76, 2016.
  10. Chung et al., “Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care,” Science, v 363, article eaau0780, 2019.
  11.  Mickle et al., “A wireless closed-loop system for optogenetic peripheral neuromodulation,” Nature, v 565, pp 361-365, 2019.
  12. Yu et al., “Skin-integrated wireless haptic interfaces for virtual and augmented reality,” Nature, v 575, pp 473-479, 2019.
  13. Kim et al.“Three-dimensional electronic microfliers inspired by wind-dispersed seeds,” Nature, v 597, pp 503-510, 2021.
  14. Bai et al., “A dynamically reprogrammable surface with self-evolving shape morphing,” Nature, v 609, pp 701-708, 2022.
  15. Choi et al., “A transient, closed-loop network of wireless, body-integrated devices for antonomous electrtherapy,” Science, v 376, pp 1006-1012, 2022.
  16. Reeder et al., “Soft, bioresorbable coolers for reversible conduction block of peripheral nerves,” Science, v 377, pp 109-115, 2022.
  17. Cheng et al., “Programming 3D curved mesosurfaces using microlattice designs,” Science, v 379, pp 1225-1232, 2023.
  18. Madhvapathy et al., “Implantable bioelectronic systems for early detection of kidney transplant rejection,” Science, v 381, pp 1105-1112, 2023.
  19. Flavin et al., “Bioelastic state recovery for haptic sensory substitution,” Nature, v 635, pp 345-352, 2024.
  20. Liu et al., “Bioresorbable shape-adaptive structures for ultrasonic monitoring of deep-tissue homeostasis,” Science, v 383, pp 1096-1103, 2024.
  21. Ha et al., “Full freedom-of-motion actuators as advanced haptic interfaces,” Science, v 387, pp 1383-1390, 2025.
  22. Shin et al., “A non-contact wearable device for monitoring epidermal molecular flux,” Nature, v 640, pp 375-383, 2025.
  23. Zhang et al., “Millimetre-scale, bioresorbable optoelectronic systems for electrotherapy,” Nature, v 640, pp 77-86, 2025.